Sizzix Die Brush & Foam Pad For Wafer Thin Dies Black

Reg: RM95

VIP RM57

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When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy manoeuvrability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cut out.

Country Of Origin
Made In China.
Composition
Acrylic, Metal, Plastic
Contents
1 Die Brush
1 Foam Pad
EAN
841182097989
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Returns Information

If you order an item online and it is not of acceptable quality or does not match the description, you can return it to us by taking the item to your nearest Spotlight store. If you are unable to get to a store, please contact our Customer Care Department.

eGift Cards are non-refundable or redeemable for cash.

Please note, we will only charge the total amount in your cart. Your bank may apply fees or exchange rates on your transaction. Please check with your bank, prior to making a purchase, to understand any extra costs.

Refunds will be provided by us for the amount that we have charged you. Your bank may apply fees or exchange rates to your refund.

For more information, read our returns policy.

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